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 SI1056X
Vishay Siliconix
N-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V) RDS(on) () 0.089 at VGS = 4.5 V 20 0.098 at VGS = 2.5 V 0.121 at VGS = 1.8 V ID (A) 1.32 1.26 1.13 5.2 Qg (Typ.)
FEATURES
* Halogen-free Option Available * TrenchFET(R) Power MOSFET * 100 % Rg Tested
RoHS
COMPLIANT
APPLICATIONS
* Load Switch for Portable Devices
SC-89 (6-LEADS)
D 1 6 D
Marking Code
D 2 D
S
XX
YY Lot Traceability and Date Code
5
G
3
4
S
Part # Code
Top View Ordering Information: SI1056X-T1-E3 (Lead (Pb)-free) SI1056X-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 C)a Pulsed Drain Current Avalanche Current Repetitive Avalanche Energy Continuous Source-Drain Diode Current Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25 C TA = 70 C Symbol VDS VGS ID IDM IAS EAS IS PD TJ, Tstg Limit 20 8 1.32b, c 1.05b, c 6 8 3.2 0.2b, c 0.236b, c 0.151b, c - 55 to 150 Unit V
A
L = 0.1 mH TA = 25 C TA = 25 C TA = 70 C
mJ A W C
THERMAL RESISTANCE RATINGS
Parameter Maximum Junction-to-Ambientb, d Notes: a. Based on TC = 25 C. b. Surface Mounted on 1" x 1" FR4 board. c. t = 5 s. d. Maximum under steady state conditions is 650 C/W. t5s Steady State Symbol RthJA Typical 440 540 Maximum 530 650 Unit C/W
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Document Number: 73895 S-80641-Rev. B, 24-Mar-08
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SI1056X
Vishay Siliconix
SPECIFICATIONS TJ = 25 C, unless otherwise noted
Parameter Static Drain-Source Breakdown Voltage VDS Temperature Coefficient VGS(th) Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductance Dynamicb Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Drain-Source Body Diode Characteristics Pulse Diode Forward Currenta Body Diode Voltage Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Reverse Recovery Fall Time Reverse Recovery Rise Time ISM VSD trr Qrr ta tb IF = 1.0 A, di/dt = 100 A/s IS = 1.0 A 0.8 10.0 3.5 6.6 3.4 6 1.2 15 5.3 ns A V nC VDS VDS/TJ VGS(th)/TJ VGS(th) IGSS IDSS ID(on) RDS(on) gfs Ciss Coss Crss Qg Qgs Qgd Rg td(on) tr td(off) tf VDD = 10 V, RL = 9.52 ID 1.05 A, VGEN = 4.5 V, Rg = 1 f = 1 MHz VDS = 10 V, VGS = 5 V, ID = 1.32 A VDS = 10 V, VGS = 4.5 V, ID = 1.32 A VDS = 10 V, VGS = 0 V, f = 1 MHz VGS = 0 V, ID = 250 A ID = 250 A VDS = VGS, ID = 250 A VDS = 0 V, VGS = 8 V VDS = 20 V, VGS = 0 V VDS = 20 V, VGS = 0 V, TJ = 85 C VDS = 5 V, VGS = 4.5 V VGS = 4.5 V, ID = 1.32 A VGS = 2.5 V, ID = 1.26 A VGS = 1.8 V, ID = 1.13 A VDS = 10 V, ID = 1.32 A 6 0.074 0.082 0.093 7.5 400 70 40 5.8 5.2 0.83 0.71 3.8 6.8 19 18 6 5.7 10.2 28.5 27 9 ns 8.7 7.8 nC pF 0.089 0.098 0.121 S 0.35 20 18.2 - 2.71 0.95 100 1 10 V mV/C V nA nA A A Symbol Test Conditions Min. Typ. Max. Unit
Notes: a. Pulse test; pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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Document Number: 73895 S-80641-Rev. B, 24-Mar-08
SI1056X
Vishay Siliconix
TYPICAL CHARACTERISTICS
6 VGS = 5 V thru 2 V 5 I D - Drain Current (A) I D - Drain Current (A)
TA = 25 C, unless otherwise noted
2.4 2.1 1.8
4
VGS = 1.5 V
1.5 1.2 TJ = 125 C 0.9 0.6 TJ = 25 C TJ = - 55 C
3
2
1 VGS = 1.0 V 0 0.0
0.3 0.0 0.0
0.6
1.2
1.8
2.4
0.4
0.8
1.2
1.6
2.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
0.15 800
Transfer Characteristics Curves vs. Temp
R DS(on) - On-Resistance ()
0.12 VGS = 1.8 V 0.09 VGS = 4.5 V 0.06 VGS = 2.5 V C - Capacitance (pF)
600
Ciss 400
200 Coss
0.03 0 1 2 3 4 5 6
0 0
Crss 4 8 12 16 20
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
5 ID = 1.3 A VGS - Gate-to-Source Voltage (V) 4 R DS(on) - On-Resistance VDS = 10 V 3 VGS = 16 V 2 1.6 1.8
Capacitance
1.4 (Normalized)
VGS = 4.5 V, ID = 1.3 A VGS = 2.5 V, ID = 1.2 A
1.2 VGS = 1.8 V, ID = 1.1 A 1.0
1
0.8
0 0 1 2 3 4 5 6
0.6 - 50
- 25
0
25
50
75
100
125
150
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Qg - Total Gate Charge (nC)
TJ - Junction Temperature (C)
Qg - Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 73895 S-80641-Rev. B, 24-Mar-08
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SI1056X
Vishay Siliconix
TYPICAL CHARACTERISTICS TA = 25 C, unless otherwise noted
10
0.20 I D = 1.3 A R DS(on) - On-Resistance ()
I S - Source Current (A)
1 TJ = 150 C TJ = 25 C
0.15
0.1
0.10 TA = 125 C 0.05
0.01
TA = 25 C
0.001 0.0
0.00
0.2 0.4 0.6 0.8 1.0
0
1
2
3
4
5
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
1.0
5.0
RDS(on) vs. VGS vs. Temperature
4.0
0.8 ID = 250 A Power (W)
3.0
VGS(th) (V)
0.6
2.0
0.4
1.0
0.2 - 50
- 25
0
25
50
75
100
125
150
0 0.01
0.1
1 Time (s)
10
100
1000
TJ - Temperature ( C)
Threshold Voltage
10 Limited by RDS(on)* 1 I D - Drain Current (A)
Single Pulse Power
1 ms 10 ms 100 ms
0.1
1s 10 s
0.01 TA = 25 C Single Pulse 0.1 1 * VGS
DC
0.001
BVDSS Limited 10 100
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VDS - Drain-to-Source Voltage (V) minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 73895 S-80641-Rev. B, 24-Mar-08
SI1056X
Vishay Siliconix
TYPICAL CHARACTERISTICS
1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02
Notes:
TA = 25 C, unless otherwise noted
0.01
PDM t1
0.001 Single Pulse 0.0001 10-4 10-3 10-2 1 10-1 Square Wave Pulse Duration (s) 10
t2 1. Duty Cycle, D =
t1 t2 2. Per Unit Base = RthJA = 540 C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
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Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?73895.
Document Number: 73895 S-80641-Rev. B, 24-Mar-08
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Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
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Document Number: 91000 Revision: 18-Jul-08
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